Open Access
Issue
MATEC Web Conf.
Volume 74, 2016
The 3rd International Conference on Mechanical Engineering Research (ICMER 2015)
Article Number 00034
Number of page(s) 3
DOI https://doi.org/10.1051/matecconf/20167400034
Published online 29 August 2016
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  3. I.S.R. Aisha, A. Ourdjini, M.A. Hanim, and O.S. Azlina, Effect of Reflow Profile on Intermetallic Compound Formation. IOP Conference Series: Materials Science and Engineering,46(1): p. 012037. (2013)
  4. H. Nishikawa and N. Iwata, Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad. Journal of Materials Processing Technology, 215(0): p.6–11. (2015) [CrossRef]
  5. L. Jiahui, M. Haitao, L. Shuang, S. Junhao, A. Kunwar, M. Wang, H. Jianjie, and B. Yanpeng. The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering. in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. (2014)
  6. S.-P. Yu, C.-L. Liao, M.-H. Hon, and M.-C. Wang, The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate. Journal of Materials Science. 35(17): p. 4217–4224. (2000) [CrossRef]
  7. M. Arenas, M. He, and V. Acoff, Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates. Journal of Elec Materi 35(7): p. 1530–1536. (2006) [CrossRef]

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