MATEC Web Conf.
Volume 78, 20162nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016)
|Number of page(s)||5|
|Published online||07 October 2016|
An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibah, 02600 Jejawi, Arau, Perlis, Malaysia
* Corresponding author: email@example.com
In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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