MATEC Web Conf.
Volume 74, 2016The 3rd International Conference on Mechanical Engineering Research (ICMER 2015)
|Number of page(s)||3|
|Published online||29 August 2016|
Effect of Flux onto Intermetallic Compound Formation and Growth
Faculty of Mechanical Engineering, Universiti Malaysia Pahang, 26600 Pekan, Pahang, Malaysia
a Corresponding author: author@firstname.lastname@example.org
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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