| Issue |
MATEC Web Conf.
Volume 74, 2016
The 3rd International Conference on Mechanical Engineering Research (ICMER 2015)
|
|
|---|---|---|
| Article Number | 00034 | |
| Number of page(s) | 3 | |
| DOI | https://doi.org/10.1051/matecconf/20167400034 | |
| Published online | 29 August 2016 | |
Effect of Flux onto Intermetallic Compound Formation and Growth
Faculty of Mechanical Engineering, Universiti Malaysia Pahang, 26600 Pekan, Pahang, Malaysia
a Corresponding author: author@rabiatull@ump.edu.my
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.
© The Authors, published by EDP Sciences, 2016
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