| Issue |
MATEC Web Conf.
Volume 78, 2016
2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016)
|
|
|---|---|---|
| Article Number | 01064 | |
| Number of page(s) | 7 | |
| DOI | https://doi.org/10.1051/matecconf/20167801064 | |
| Published online | 07 October 2016 | |
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia.
* Corresponding author: mohdizrulizwan@gmail.com
The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.
© The Authors, published by EDP Sciences, 2016
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