MATEC Web Conf.
Volume 237, 20182018 3rd International Conference on Design, Mechanical and Material Engineering (D2ME 2018)
|Number of page(s)||5|
|Section||Chapter 2: Material Engineering|
|Published online||26 November 2018|
Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint
1 Center of Mechanical and Materials Engineering, Faculty of Engineering and Built Environment, SEGi University No. 9, Jalan Teknologi, Taman Sains Selangor, Kota Damansara PJU 5, 47810, Petaling Jaya, Selangor, Malaysia
2 Lee Kong Chian Faculty of Engineering and Science, Universiti Tunku Abdul Rahman, Jalan Sungai Long, Bandar Sungai Long 43000, Kajang, Selangor, Malaysia
a Corresponding author: firstname.lastname@example.org
Demand towards smaller electronic devices prompts the electronic interconnection to have less density and minimal weight percentage and such of this concern tips to applications of nanoparticles incorporation to the solder alloy. In this work, the effect of titanium dioxide (TiO2) nanoparticles (<100nm) additions on the performance of wettability micro hardness, and shear strength of the Sn-3.8Ag-0.7Cu (SAC) solder alloy soldered on the Copper (Cu) substrate was investigated. The SAC added 3% TiO2 nanoparticles had a slight decrease in the micro hardness compared to the plain SAC in this study but the value still surpasses many other common solder alloy’s hardness value. The wettability test was conducted by taking account the contact angle achieved by soldering the SAC added 3% TiO2 solder alloy to the Cu substrate and contact angle produced was less than 40°. As for the shear strength, there was a clear increment of 13% in the shear strength compared to the plain SAC solder alloy. Quite observant, the additions of TiO2 nanoparticles displayed significant influence on these properties that contributes to excellent performance. Much detailed discussion are elaborated in the content below aiding with results and theory behind the result achieved.
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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