| Issue |
MATEC Web of Conferences
Volume 27, 2015
2015 4th International Conference on Engineering and Innovative Materials (ICEIM 2015)
|
|
|---|---|---|
| Article Number | 02003 | |
| Number of page(s) | 5 | |
| Section | Novel materials and properties | |
| DOI | https://doi.org/10.1051/matecconf/20152702003 | |
| Published online | 20 October 2015 | |
A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy
Faculty of Engineering and Built Environment, SEGi University, No. 9, Jalan Teknologi, Taman Sains Selangor, Kota Damansara PJU 5, 47810 Petaling Jaya, Selangor, Malaysia
Faculty of Engineering and Technology, Multimedia University, 75450 Ayer Keroh, Melaka, Malaysia
a Corresponding author: amaressinghgill@segi.edu.my
b ervina.noor@mmu.edu.my
Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructure and mechanical strand. In this aspect, the Sn-3.8Ag-0.7Cu (SAC) solder alloys are recommended as potential candidate to assure these benefits. In this study, the solder possesses melting temperature of, TM=227°C which is below the desired soldering temperature, TM=250°C. Besides, this SAC solder produces well-defined microstructures with Sn-matrix and eutectic phase consisting Cu6Sn5 and Ag3Sn displayed from SEM image, contributes in harvesting good mechanical properties. The SAC solder also provides a high hardness value with an average of 14.4Hv for Vickers hardness. All these results seem to satisfy the need of a viable solder alloy.
© Owned by the authors, published by EDP Sciences, 2015
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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