Open Access
MATEC Web Conf.
Volume 82, 2016
2016 International Conference on Design, Mechanical and Material Engineering (D2ME 2016)
Article Number 02009
Number of page(s) 6
Section Chapter 2: Materials Engineering
Published online 31 October 2016
  1. Y.Y. Su, K. Srihari, C.R. Emerson, Computers and industrial engineering, A profile identification system for surface mount printed circuit board assembly, 33, 377–380(1997) [Google Scholar]
  2. Y. Guo, Z.L. Sun, E.S. Pan, Q. Yang, Journal of Northeastern University(Natural Science), Forecast of SMT Reflow Soldering Profile Based on Improved Artificial Neural Network, 32(12), 1749–1752 (2011) [Google Scholar]
  3. T.N. Tsai, Expert Systems with Applications, Development of a soldering quality classifier system using a hybrid data mining approach, 39, 5727–5738 (2012) [Google Scholar]
  4. L.G. Barajas, M.B. Egerstedt, E.W. Kamen, A. Goldstein, IEEE Transactions on Electronics Packaging Manufacturing, Stencil printing process modeling and control using statistical neural networks, 31(1), 9–18 (2008) [Google Scholar]
  5. L.J. Pan, J.Q. Chen. Experimental Design and Data Processing. Nanjing: Southeast University Press (2008). [Google Scholar]
  6. Z.G. Feng, D.W. Yu, Y.H. Zhu, Electronics Process Technology, Effect of parameters of reflow oven on the Reflow Profile, 25(6), 243–246 (2004) [Google Scholar]
  7. M. Yan, Z.L. Sun, Q. Yang, Chinese Journal of Mechanical Engineering, Analysis method of reliability sensitivity based on response surface methods, 43(10), 67–71 (2007) [Google Scholar]

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