| Issue |
MATEC Web Conf.
Volume 82, 2016
2016 International Conference on Design, Mechanical and Material Engineering (D2ME 2016)
|
|
|---|---|---|
| Article Number | 02009 | |
| Number of page(s) | 6 | |
| Section | Chapter 2: Materials Engineering | |
| DOI | https://doi.org/10.1051/matecconf/20168202009 | |
| Published online | 31 October 2016 | |
Reflow Process Parameters Analysis and Reliability Prediction Considering Multiple Characteristic Values
1
School of Mechanical Engineering & Automation, Northeastern University, Shenyang, China, 110819
2
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang, China, 110168
a Corresponding author: guoyu@me.neu.edu.cn
As a major step surface mount technology, reflow process is the key factor affecting the quality of the final product. The setting parameters and characteristic value of temperature curve shows a nonlinear relationship. So parameter impacts on characteristic values are analyzed and the parameters adjustment process based on orthogonal experiment is proposed in the paper. First, setting parameters are determined and the orthogonal test is designed according to production conditions. Then each characteristic value for temperature profile is calculated. Further, multi-index orthogonal experiment is analyzed for acquiring the setting parameters which impacts the PCBA product quality greater. Finally, reliability prediction is carried out considering the main influencing parameters for providing a theoretical basis of parameters adjustment and product quality evaluation in engineering process.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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