MATEC Web Conf.
Volume 224, 2018International Conference on Modern Trends in Manufacturing Technologies and Equipment (ICMTMTE 2018)
|Number of page(s)||8|
|Section||Manufacturing Technologies, Tools and Equipment|
|Published online||30 October 2018|
The process of interaction between abrasive disk and a workpiece while grinding under ultrasonic vibrations
Ulyanovsk State Technical University, Ulyanovsk, Russia
* Corresponding author: email@example.com
This research includes the analysis of kinematic relations between abrasive disk grains and the workpiece in the abrading process while applying ultrasonic vibrations (USV) on the workpiece. Supposition, that applying vibrations lied in axes of abrasive disk increases efficiency of disk grinding, has been set. Analytical approach showed dependences for calculating the grinding force. These dependences include changing of disk grains microcutting kinematics and mechanical characteristics of workpieces while applying USV. The technique of pilot studies is given. For imposing on preparation of USV used the device in which it was one of links of oscillatory system that provides the minimum losses of energy USV and high amplitude of fluctuations of preparation. Field researches have shown, that applying USV lied in axes of abrasive disk decreased the grinding force, the wear of disk, and high-level parameters of the processed surface roughness.
© The Authors, published by EDP Sciences, 2018
This is an open access article distributed under the terms of the Creative Commons Attribution License 4.0 (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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