Open Access
Issue
MATEC Web Conf.
Volume 77, 2016
2016 3rd International Conference on Mechanics and Mechatronics Research (ICMMR 2016)
Article Number 02003
Number of page(s) 4
Section Modeling and Simulation
DOI https://doi.org/10.1051/matecconf/20167702003
Published online 03 October 2016
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  5. H.-W. Shim and T. H. Hubing, “Model for estimating the radiated emissions from a printed circuit board with attached cables due to voltage driven sources,” IEEE Trans. Electromagnetic Compatibility, vol. 47, no. 4, pp. 899–907, Nov. 2005. [CrossRef]
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  7. D. M. Hockanson, X. Ye, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and R. E. Du Broff, “FDTD and experimental investigation of EMI from stacked-card PCB configurations,” IEEE Trans. Electromagnetic Compatibility. vol. 43, no. 1, pp. 1–10, Feb. 2001. [CrossRef]
  8. J. E. Bracken, S. Poltyanko, S. Raman, and Z. J. Cendes, “Efficient full wave simulation of high-speed printed circuit boards and electronic packages,” in Proc. IEEE Antennas Propagation. Soc. Int. Symp. 2004, Jun. 20–25, vol. 3, pp. 3301–3304.

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