MATEC Web Conf.
Volume 77, 20162016 3rd International Conference on Mechanics and Mechatronics Research (ICMMR 2016)
|Number of page(s)||4|
|Section||Modeling and Simulation|
|Published online||03 October 2016|
- Ji ZHANG, Juan SHI, Tengfei Yang. Radiated emission test and its reduction of PCB [J]. Journal of Jiamusi University, 2012, v.30; No.12005:706–709+713.
- Yang ZHAO, Wei YAN, Bo ZHAO, Y.C LUO, Shijin LI. Evaluation and Tests of Circuit Radiated EMI [J]. DIANGONG JOURNAL, 2010, v.2510:6–13.
- Christian Poschalko, IEEE TRANS ON EMC [J]. Vent Model for the Slot Radiation of an Enclosure Excited by Printed Circuit Board Traces with Different Loads.
- M. Leone, “Design expressions for the trace-to-edge common-mode inductance of a printed circuit board,” IEEE Trans. Electromagnetic. Compatibility. vol. 43, no. 4, pp. 667–671, Nov. 2001. [CrossRef]
- H.-W. Shim and T. H. Hubing, “Model for estimating the radiated emissions from a printed circuit board with attached cables due to voltage driven sources,” IEEE Trans. Electromagnetic Compatibility, vol. 47, no. 4, pp. 899–907, Nov. 2005. [CrossRef]
- D. M. Hockanson, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “FDTD modeling of common-mode radiation from cables,” IEEE Trans on Electromagnetic Compatibility., vol. 38, no. 3, pp. 376–387, Aug. 1996. [CrossRef]
- D. M. Hockanson, X. Ye, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and R. E. Du Broff, “FDTD and experimental investigation of EMI from stacked-card PCB configurations,” IEEE Trans. Electromagnetic Compatibility. vol. 43, no. 1, pp. 1–10, Feb. 2001. [CrossRef]
- J. E. Bracken, S. Poltyanko, S. Raman, and Z. J. Cendes, “Efficient full wave simulation of high-speed printed circuit boards and electronic packages,” in Proc. IEEE Antennas Propagation. Soc. Int. Symp. 2004, Jun. 20–25, vol. 3, pp. 3301–3304.
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