| Issue |
MATEC Web Conf.
Volume 77, 2016
2016 3rd International Conference on Mechanics and Mechatronics Research (ICMMR 2016)
|
|
|---|---|---|
| Article Number | 02003 | |
| Number of page(s) | 4 | |
| Section | Modeling and Simulation | |
| DOI | https://doi.org/10.1051/matecconf/20167702003 | |
| Published online | 03 October 2016 | |
Co-Simulation of PCB and Enclosure to Predict Radiated Emission
China Automotive Technology & Research Center, Tianjin 300300, China
With highly requirement for electromagnetic compatibility (EMC) target, effective controlling of radiated emission of equipment or subsystem is of considerable significance. An emission equivalent model of Printed Circuit Board (PCB) is set up in this paper. Prediction of resonance characteristics, far field radiation of the PCB is carried out and analysed. Then, a 3-D model of a typical equipment enclosure is set up. Resonance characteristics and radiating characteristics of the enclosure is carried out and analysed. A co-simulation method to predict radiated emission is proposed and an example of co-design of PCB and enclosure using HFSS and Siwave verified this method.
© The Authors, published by EDP Sciences, 2016
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