Open Access
MATEC Web of Conferences
Volume 40, 2016
2015 International Conference on Mechanical Engineering and Electrical Systems (ICMES 2015)
Article Number 07016
Number of page(s) 5
Section Power electronics engineering
Published online 29 January 2016
  1. Raithel, Stephan. Innovation Driven by Semiconductors. Retrieved from Last visited on July 2015. (2015). M. Ben Rabha, M.F. Boujmil, M. Saadoun, B. Bessa&ïs, Eur. Phys. J. Appl. Phys. (to be published) [Google Scholar]
  2. Nirmala, Junko. Rise and Fall of Japan&’s Electronics-Semiconductor Industry : Will India take lead?. Retrieved from Last visited on July 2015. (2015). [Google Scholar]
  3. Serdijn, W. A., Van Der Woerd, A. C., Van Roermund, A. H., & Davidse, J. Design principles for low-voltage low-power analog integrated circuits. Analog Integrated Circuits and Signal Processing, 8.1 (1995): 115–120. [CrossRef] [Google Scholar]
  4. Prodanov, Vladimir I., and Michael M. Green. “Design Techniques and Paradigms Toward Design of Low-Voltage CMOS Analog Circuits.” Electrical Engineering (1997): 152. [Google Scholar]
  5. Marks, Tobin J., and Mark C.. Hersam “Materials science: Semiconductors grown large and thin.” Nature 520.7549 (2015): 631–632. [CrossRef] [Google Scholar]
  6. Harrison, R.R.; Charles, C., “A low-power low-noise CMOS amplifier for neural recording applications,” pp.958–965, June 2003. [Google Scholar]
  7. Kim, Dae-Hyeong, et al. “Stretchable and foldable silicon integrated circuits.”Science 320.5875 (2008): 507–511. [CrossRef] [PubMed] [Google Scholar]
  8. Cevik, Ismail, et al. “An Ultra-Low Power CMOS Image Sensor with On-Chip Energy Harvesting and Power Management Capability.” Sensors 15.3 (2015): 5531–5554. [CrossRef] [Google Scholar]
  9. Soeleman, H., Roy, K. and Paul, B., ―Robust ultra-low power subthreshold DTMOS logic,” in ISLPED, pp. 25–30, 2000. [Google Scholar]
  10. Sicard, Etienne, and Dienot. J. M. “Issues in electromagnetic compatibility of integrated circuits: emission and susceptibility.” Microelectronics reliability 45.9 (2005): 1277–1284. [CrossRef] [Google Scholar]
  11. Ramdani, M., Sicard, E., Boyer, A., Ben Dhia, S., Whalen, J. J., Hubing, T., Coenen, M., and Wada, O., ―The electromagnetic compatibility of integrated circuits—Past, present and future,‖ IEEE Trans. Electromagn. Compat., vol. 51, no. 1, pp. 78–100, Feb. 2009. [CrossRef] [Google Scholar]
  12. Wang, Deli. Nanoelectronics [Presentation slide]. Retrieved from Last visited on July 2015. (2010). [Google Scholar]
  13. Erkmen, B. Integrated Circuit Technology Overview [Presentation slide]. Retrieved from Last visited on July 2015. (2014). [Google Scholar]
  14. Erkmen, B. Type of Semiconductor Packaging [Technical Reference]. Retrieved July 7, 2015, from RS Australia Electronics Centre: (2009). [Google Scholar]
  15. Allan, A. 2008 ITRS ORTC [Public Conference Preparation]. Retrieved July 7, 2015, from International Technology Roadmap for Semiconductors:¬¬.(2008). [Google Scholar]
  16. Peschot, Alexis, Chuang, Qian, and Tsu-Jae KingLiu. “Nanoelectromechanical Switches for Low-Power Digital Computing.” Micromachines 6.8 (2015): 1046–1065. [CrossRef] [Google Scholar]
  17. Bassett, Deborah R. “Taniguchi, Norio”. In Guston, David H. Encyclopedia of nanoscience and society. London: SAGE. p. 747. ISBN 9781452266176. Retrieved 3 july 2015. (2010) [Google Scholar]
  18. Rahman, Mohd Nizam Ab, et al. “Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components”. Materials 7.12 (2014): 7706–7721. [CrossRef] [Google Scholar]
  19. Vidhya, M., & Kamalakannan, R.S. Implementation of MCC ADDER with low power dissipation based on spst. International Journal of Research Science & Management 2.5 (2015),:12–18. [Google Scholar]
  20. Bennett, Herbert S. “Will future measurement needs of the semiconductor industry be met?.” Journal of Research-National Institute of Standards and Technology 112.1 (2007): 25. [CrossRef] [Google Scholar]
  21. Agenda, S. I. A. “Letter from the President 6 The Man Behind the Law 8 40 Years of Moore’s Law 10 Moore’s Law and the Emergence of the New Economy 16 About SIA 21.” [Google Scholar]
  22. Liu, Yingxia, et al. “A metastable phase of tin in 3D integrated circuit solder microbumps.” Scripta Materialia 102 (2015): 39–42. [CrossRef] [Google Scholar]
  23. Huynh, Hai Au, et al. “Analysis of Power Transfer Efficiency of Standard Integrated Circuit Immunity Test Methods.” International Journal of Antennas and Propagation 2015 (2015). [Google Scholar]
  24. Sarkar, Aveek. “Low Power, High Performance.” Excellence in Engineering Simulation (2011): 26. [Google Scholar]
  25. Bohr, Mark, and Kaizad Mistry. “Intel’s revolutionary 22 nm transistor technology.” Intel website (2011). [Google Scholar]
  26. “Research.” Research. E3S Center for Energy Efficient Electronics Science, n.d. Web. 18 Sept. 2015. <>. [Google Scholar]
  27. Carlton, Ross M. “An overview of standards in electromagnetic compatibility for integrated circuits.” Microelectronics journal 35.6 (2004): 487–495. [CrossRef] [Google Scholar]
  28. Kim, Nam Sung, et al. “Leakage current: Moore’s law meets static power.” computer 36.12 (2003): 68–75. [Google Scholar]
  29. Kaware, U. W., Ms Anushri Garud, and Mr Shubham Deshmukh. “A DFT technique for MCM (Multi Chip Module) testing.” nature 4.1 (2015). [Google Scholar]
  30. Schaller, Robert R. Technological innovation in the semiconductor industry: a case study of the International Technology Roadmap for Semiconductors (ITRS). Diss. George Mason University, 2004. [Google Scholar]
  31. Shanmugavel, Arvind. “Robust Design for Integrated Circuits.” (2013).\ [Google Scholar]
  32. Deptuch, Grzegorz W., et al. “Results of tests of three-dimensionally integrated chips bonded to sensors.” Nuclear Science, IEEE Transactions on 62.1 (2015): 349–358. [CrossRef] [Google Scholar]
  33. Mei, Qinggao, et al. “An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits.” (2015). [Google Scholar]
  34. Allec, Nicholas, et al. “ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits.” Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on. IEEE, 2008. [Google Scholar]
  35. Joshi, Yogendra K. “An Efficient Approach for MULTI-SCALE Thermal Modeling of Integrated Circuits.” Electronics Cooling Magazine Focused on Thermal Management TIMs Fans Heat Sinks CFD Software LEDsLighting. Electronics Cooling, 15 Sept. 2015. Web. 18 Sept. 2015. <>. [Google Scholar]

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