Issue |
MATEC Web Conf.
Volume 297, 2019
X International Scientific and Practical Conference “Innovations in Mechanical Engineering” (ISPCIME-2019)
|
|
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Article Number | 09002 | |
Number of page(s) | 5 | |
Section | Processes Abrasive Machining, Abrasive Tools and Materials | |
DOI | https://doi.org/10.1051/matecconf/201929709002 | |
Published online | 13 November 2019 |
Mechanism of Chip Formation Process at Grinding
1
Volzhsky Polytechnic Institute (branch) of Volgograd State Technical University, 404121, Volzhsky, Volgograd region, Engelsa street, 42a
2
Carborundum Universal Limited, No.655, T.H.Road, Thiruvottiyur Chennai- 600019, India
* Corresponding author: vms22@yandex.ru
The mechanism of chip formation process at grinding is described, which involves a high-speed interaction of abrasive grain and metal, which leads to a concentration of thermal energy in front of the dispersing element (grain), causing a locally concentrated shift in the metal microvolume. In “abrasive grain -metal” contact a dissipative structure is formed which existence is supported by exchange of energy and substance with environment. Due to shock compression of the metal microvolume with abrasive grain, shock-wave heating is realized, initiating emission of electrons ionizing the lubricating cooling fluid in the zone of formation of side micro-scratches left by abrasive. The results obtained in the course of the research can be used to explain the mechanisms of chip formation, as well as the course of the physical and mechanical processes occurring on the surface layers of the grinded workpieces. By controlling chip formation processes at high-speed grinding, by optimally selecting the appropriate ratios between cutting speed and other processing parameters, a reduction in process thermal density can be achieved, which, with the highest productivity, will allow to obtain the required quality of the surface layer of the workpieces and a given dimensional accuracy.
© The Authors, published by EDP Sciences, 2019
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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