MATEC Web Conf.
Volume 192, 2018The 4th International Conference on Engineering, Applied Sciences and Technology (ICEAST 2018) “Exploring Innovative Solutions for Smart Society”
|Number of page(s)||4|
|Section||Track 1: Industrial Engineering, Materials and Manufacturing|
|Published online||14 August 2018|
Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate
Industrial Engineering Department, Faculty of Engineering, King Mongkut’s Institute of Technology Ladkrabang, Bangkok, Thailand
Corresponding author: email@example.com
In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated. Reflow soldering was performed at 350 ° C under variable soldering times of 10, 20, 40, 60, 120, 240 and 480 s. The results indicated that the wettability and intermetallic growth depend on the soldering time. In addition, the Cu6Sn5 and Cu3Sn intermetallic phases with a hexagonal crystal structure were found between the lead-free solder and the copper substrate. The growth of intermetallic phases increased with soldering time, and the growth of intermetallic phases remarkably depended on grain boundary diffusion and was volume diffusion-controlled for Cu6Sn5 and Cu3Sn, respectively.
© The Authors, published by EDP Sciences, 2018
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