Development and application of methods to characterize micro semi-finished products and micro components

Leibniz Institute for Materials Engineering IWT, 28359 Bremen, Germany

^* Corresponding author: koehler@iwt-bremen.de

Abstract

In the production of semi-finished products for the production of microcomponents and the components themselves, the characterization of their physical properties is of particular importance. Due to the often oligocrystalline character of these semi-finished products and components, it is necessary to use a suitable testing technique for static and dynamic investigations, as the mechanical properties are not transferable from the macroscopic point of view. In addition, the micro semi-finished products and components often show inhomogeneities induced by the manufacturing process. On the one hand, these are directly reflected in the microstructure and on the other hand they have an effect on quantities such as hardness or residual stresses, which play a decisive role in the application. Mechanical testing, conventional metallography, scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), ultra-microhardness testing and X-ray residual stress analysis were used as measuring and analysis techniques suitable for the sub-millimeter range. In the following, the possibilities and limitations of two these methods are illustrated using the example of mechanical testing and EBSD. In this paper several examples for possible characterization techniques are given.