MATEC Web Conf.
Volume 144, 2018International Conference on Research in Mechanical Engineering Sciences (RiMES 2017)
|Number of page(s)||13|
|Published online||09 January 2018|
Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure
Department of Mechanical Engineering, Mar Baselios College of Engineering & Technology, Thiruvananthapuram, Kerala
* Corresponding author: email@example.com
Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be generated and quickly assessed. The present numerical study aims at developing a computational tool in OpenFOAM that can predict the heat dissipation rate and temperature profile of any electronic component in operation. A suitable computational domain with defined aspect ratio is chosen. For analyzing, “buoyant Boussinesq Simple Foam“ solver available with OpenFOAM is used. It was modified for adapting to the investigation with specified initial and boundary conditions. The experimental setup was made with the dimensions taken up for numerical study. Thermocouples were calibrated and placed in specified locations. For different heat input, the temperatures are noted down at steady state and compared with results from the numerical study.
Key words: Heat transfer / OpenFOAM / Boussinesq / Aspect ratio
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).
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