MATEC Web Conf.
Volume 125, 201721st International Conference on Circuits, Systems, Communications and Computers (CSCC 2017)
|Number of page(s)||5|
|Published online||04 October 2017|
Dividing of metal and plastic components of printed circuit boards
1 Tomas Bata Univerzity in Zlín, Faculty of Applied Informatics, nám. T.G.Masaryka 5555, 760 01 Zlín, Czech Republic
2 Technical University of Kosice, Faculty of Mechanical Engineering, Department of Automation, Control and Human Machine Interaction, Letná 9, 04200 Košice, Slovakia
3 Tomas Bata Univerzity in Zlín, Faculty of Technology, nám. T.G.Masaryka 5555, 760 01 Zlín, Czech Republic
* Corresponding author: firstname.lastname@example.org
This paper contents one possibility of PCB separation due to the temperature due to the different thermal expansion of the metal path and the plastic from which the boards are made. Using the knowledge from the literary study and the simulation environments used, we have reached the maximum analysis of the problem. The separation of metal and plastic may occur due to temperature changes if the temperature difference is sufficient. We have carried out a study of printed circuit board production so we can choose the appropriate path of separation. Furthermore, we calculated the shear stress size required to tear the conductive copper paths from the epoxy resin. The temperature field in a two-layer board was modeled in the FEMLAB and Pro/ENGINEER programming environments. From the simulated temperature field simulations, conclusions can be drawn that accurately describe the condition and characteristics of materials subjected to heat shock. They derived the resulting relationship for calculating the resulting shear stress needed to separate the conductive paths and plastic materials of the PCB. In our own experiments, we used several ways to heat PCBs. The temperature is also sufficient for the separation of tin. After using the mechanical separation of the components, they were dropped from the PCB. Mechanical separation was also used when removing conductive paths. This separation is effective, but in the newer types of PCBs, the cyclical effects of thermal shock have to be applied to the separation of copper paths. Laboratory tests have demonstrated the viability of the proposed solution. The proposed method of recycling could lead to industrial use, which requires consistent sorting of waste electrical and electronic equipment.
© The Authors, published by EDP Sciences, 2017
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.