MATEC Web Conf.
Volume 210, 201822nd International Conference on Circuits, Systems, Communications and Computers (CSCC 2018)
|Number of page(s)||4|
|Published online||05 October 2018|
Modeling of the ecological separation process of printed circuit boards
Tomas Bata University in Zlín, Faculty of Applied Informatics, nám. T.G.Masaryka 5555, 760 01 Zlín, Czech Republic
2 Technical University of Košice, FMT, Bayerova 1, 08001 Prešov, Slovakia
3 VSB – Technical University of Ostrava, Faculty of Mechanical Engineering, 17.listopadu 15, 708 33 Ostrava, Czech Republic
4 Technical University of Košice, FM, Letná 9, 042 00 Košice, Slovakia
* Corresponding author: email@example.com
The content of this paper is the modeling of the stress in the printed circuit board due to the cyclic thermal stress for its ecological recycling. Cyclic thermal stresses result in separation of copper conduction paths and plastic plates due to different longitudinal expansion. For separation, it was important to determine the minimum temperature of the cyclical changes to separate the conductive copper paths and the plastic. We use mathematical modeling tools to describe the course of temperature fields in the PCB during heating and reheating. We conducted some simulation experiments in the Pro/ENGINEER programming environment to know the waveforms and stresses of the PCBs during the cyclic loading cycle. From experiments conducted in the laboratory, we have verified that the process of temperature separation is feasible for designing an eco-friendly way of recycling PCBs.
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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