MATEC Web Conf.
Volume 80, 2016NUMIFORM 2016: The 12th International Conference on Numerical Methods in Industrial Forming Processes
|Number of page(s)||8|
|Section||Topic 4: Application to composites, polymers and other materials|
|Published online||24 October 2016|
Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis
MEMS, University of Minho, Dep. of Mechanical Engineering, Campus de Azurém, 4800-058 Guimarães , Portugal
2 Bosch Car Multimedia Portugal S.A., Apartado 2458, 4705-820 Braga, Portugal
a Corresponding author: email@example.com
Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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