MATEC Web Conf.
Volume 95, 20172016 the 3rd International Conference on Mechatronics and Mechanical Engineering (ICMME 2016)
|Number of page(s)||5|
|Section||Mechanical Design-Manufacture and Automation|
|Published online||09 February 2017|
Reactive Ion Etching Process of Micro Mechanical Pendulum
Sensing Technology Center of Beijing Information Science and Technology University, Beijing 100101, China
This paper describes the reactive ion etching (RIE) technique of micro mechanical pendulum chip. Micro mechanical pendulum chip processed by the RIE has excellent performances and surface of the chip is smoother than the chip by wet etching. Properties of chip are closely associated with the process parameters. Reactive ion etching technique improves the problems such as intricate lateral etching and surface deficiency of the wet etching. On the basis of method and many experiments of the ion etching, relation between etching rate, etching uniformity, sidewall profiles and process parameters was analyzed and a set process parameters with greater etching effect was obtained. The set process parameters includes etching depth 55μm, etching uniformity (U) 0.63% and selectivity (P) 90:1, etching rate (V) 5.75μm/min, verticality of sidewall 90°±1°.
© The Authors, published by EDP Sciences, 2017
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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