Issue |
MATEC Web Conf.
Volume 72, 2016
Heat and Mass Transfer in the System of Thermal Modes of Energy – Technical and Technological Equipment (HMTTSC-2016)
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Article Number | 01086 | |
Number of page(s) | 5 | |
DOI | https://doi.org/10.1051/matecconf/20167201086 | |
Published online | 09 August 2016 |
Solving Problem of Thermal Conduction for Providing Strength of Electronic Units on Thermal Impacts
1 Khmelnitskiy National University, Drawing and Graphic Design Department, 29016 11 Institutska Str., Khmelnitskiy, Ukraine
2 Khmelnitskiy National University, Radio Engineering and Communication Department, 29016 11 Institutska Str., Khmelnitskiy, Ukraine
* Corresponding author: svitlana.petrashchuk@gmail.com
Paper represents new approach to physical and mathematical modeling of thermal fields distribution in sealed electronic units on the base of introducing “effective parameters” of the system. Effectiveness of developed mathematical model and its computer implementing are demonstrated on the example of standard unit sealed by compound.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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