MATEC Web Conf.
Volume 302, 201918th International Conference Diagnostics of Machines and Vehicles
|Number of page(s)||10|
|Section||Diagnostics of Various Technical Objects|
|Published online||29 November 2019|
Methods for Vibration Reduction in Enclosed Electronic Packages
1 Technologies and Design Faculty in Khmelnytsky National University, Department of Art and Technical Graphics, 29016, 11, Instytuts’ka str., Khmelnitsky, Ukraine
2 Programming and Computer, Telecommunication Systems Faculty in Khmelnytsky National University, Department of Telecommunication and Radio Engineering, 29016, 11, Instytuts’ka str., Khmelnitsky, Ukraine
3 Faculty of Mechanical Engineering UTP in Bydgoszcz, Department of Vehicle Engineering, Al. prof. S.Kaliskiego 7, 85-796 Bydgoszcz, Poland
* Corresponding author: email@example.com
Excitation and transmission of vibration inside electronic packages are strongly connected with mechanical characteristics of their enclosure, which are in the objective for the current research aimed at developing methods and means to reduce vibration inside the enclosure case. The main idea of the introduced methods is in creating elastic and dissipative mechanical joints between structural elements, which appear to be the links for vibration transmission, inside and outside of the electronic package enclosure. The effectiveness of developed methods is proved by experimental verification and theoretical foundation.
© The Authors, published by EDP Sciences, 2019
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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