MATEC Web of Conferences
Volume 21, 20154th International Conference on New Forming Technology (ICNFT 2015)
|Number of page(s)||6|
|Published online||10 August 2015|
Microstructure evolution and surface cleaning of Cu nanoparticles during micro-forming fields activated sintering technology
1 School of Manufacturing Science and Engineering, Sichuan University, Chengdu, Sichuan 610065, PR China
2 Department of Design, Manufacture and Engineering Management, University of Strathclyde, James Weir Building, 75 Montrose Street, Glasgow G1 1XQ, UK
a Corresponding author: e-mail: email@example.com
For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.
© Owned by the authors, published by EDP Sciences, 2015
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