MATEC Web of Conferences
Volume 8, 2013Progress in Ultrafast Laser Modifications of Materials
|Number of page(s)||2|
|Section||Femtosecond laser-induced modifications in various materials|
|Published online||18 November 2013|
Scaling of black silicon processing time by high repetition rate femtosecond lasers
1 Center for Nano Science and Technology@PoliMi, Istituto Italiano di Tecnologia, Via Giovanni Pascoli, 70/3, 20133, Milan, Italy
2 Dipartimento di Fisica, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133, Milan, Italy
3 Istituto di Fotonica e Nanotecnologie – CNR, Piazza Leonardo da Vinci 32, 20133, Milan, Italy
* e-mail: Krishna.Vishunubhatla@iit.it
Surface texturing of silicon substrates is performed by femtosecond laser irradiation at high repetition rates. Various fabrication parameters are optimized in order to achieve very high absorptance in the visible region from the micro-structured silicon wafer as compared to the unstructured one. A 70-fold reduction of the processing time is demonstrated by increasing the laser repetition rate from 1 kHz to 200 kHz. Further scaling up to 1 MHz can be foreseen.
© Owned by the authors, published by EDP Sciences, 2013
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 2.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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