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Cited article:

Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

Y.W. Pok, D. Sujan, M.E. Rahman, S.S. Dol

MATEC Web Conf., 95 (2017) 01003

Published online: 2017-02-09

DOI: https://doi.org/10.1051/matecconf/20179501003

This article has been cited by the following article(s):

New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

Baptiste Arati, Vincent Bley, Pierre-Yves Pichon and Gilbert Teyssedre
IEEE Access 11 133967 (2023)
https://doi.org/10.1109/ACCESS.2023.3334632