Open Access
MATEC Web Conf.
Volume 252, 2019
III International Conference of Computational Methods in Engineering Science (CMES’18)
Article Number 09005
Number of page(s) 4
Section Probability, Statistics Quality Control
Published online 14 January 2019
  1. G.F. Eichinger; K. Baumann; T. Martin; M. Jones Proceedings of the 11th IEEE International Symposium on Wearable Computers 11–13 (2007) [Google Scholar]
  2. T. Linz, L. Gourmelon, G. Langereis International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2007), 29–34 (2007) [CrossRef] [Google Scholar]
  3. C. JaeHan, Y. Kim, K. Lee, Y.C. Chung IEEE Antennas and Propagation Society International Symposium 5–11 (2008) [Google Scholar]
  4. T. Xuyuan, K. Vladan, H. Tzu-Hao, S. Chien-Lung, K. Ya-Chi, J. Gwo-Tsuen Sensors 17, 673 (2017) [CrossRef] [Google Scholar]
  5. A. Jakubas, E. Łada-Tondyra The Journal of The Textile Institute (2018) [Google Scholar]
  6. J. Zięba, M. Frydrysiak, K. Gniotek FIBRES & TEXTILES in Eastern Europe 15(5) 64 - 65(2007) [Google Scholar]
  7. X. Tao, V. Koncar, T.H. Huang, C.L. Shen, Y.C. Ko, G.T. Jou: Sensors (Basel) 17(4): 673 (2017). [CrossRef] [Google Scholar]
  8. L. Kasprzyk, A. Tomczewski, K. Bednarek Przeglad Elektrotechniczny 87(12) 82-85 (2011) [Google Scholar]
  9. L. Kasprzyk, K. Bednarek Przeglad Elektrotechniczny 85(12) 65-68 (2009) [Google Scholar]
  10. E. Korzeniewska, M. Walczak, J. Rymaszewski MIXDES 24th International Conference “Mixed Design of Integrated Circuits and Systems 447 - 450, article number 8005250 (2017) [Google Scholar]
  11. B. Warcholiński, A. Gilewicz, P. Myśliński Reviews on Advanced Materials Science. 22(2009) 81-88 [Google Scholar]
  12. X. Li, W. Yue, C. Wang, J. Liu, G. Li Journal of Tribology 139 (6) (2017) [Google Scholar]
  13. N. W. Khun, A. Neville, I. Kolev, H. Zhao Journal of Tribology 138 (3) doi: 10.1115/1.4031995 (2016) [Google Scholar]
  14. J. Jozwik, L. Semotiuk, I. Kuric, Adv. Sci. Technol. Res. J. 2015; 9(28):96–102 [CrossRef] [Google Scholar]
  15. R. Pawlak, E. Korzeniewska, Z. Stempien, Selected Issues of Electrical Engineering and Electronics, WZEE 2016, 7800248 (2016) [Google Scholar]
  16. E. Korzeniewska, J. Józwik, R. Zawiślak, A. Krawczyk, J. Michałowska Przeglad Elektrotechniczny 12(93) 111-114 (2017) [Google Scholar]
  17. M. Barszcz, J. Józwik, K. Dziedzic, K. Stec. E3S WEB OF CONFERENCES. 2017, vol. 19, s. 1-6 [Google Scholar]
  18. G. M. Krolczyk, J. B. Krolczyk, R. W. Maruda, S. Legutko, M. Tomaszewski Measurement 88 176–185 (2016) [CrossRef] [Google Scholar]
  19. R. Pawlak, M. Lebioda, J. Rymaszewski, W. Szymanski, L. Kołodzieczyk, P. Kula, Sensors 17(1) article number: 51 (2017) [Google Scholar]
  20. Jozwik, Jerzy; Czwarnowski, Marek : Adv. Sci. Technol. Res. J. 2015; 9(28):89–95. [CrossRef] [Google Scholar]
  21. G. M. Krolczyk, P. Nieslony, R. W. Maruda, S. Wojciechowski Journal of Cleaner Production 142 3343-3354 (2017) [CrossRef] [Google Scholar]
  22. J. Jozwik: Tehnicki Vjesnik Technical Gazette. 2018, nr 25, Supl.1, s. 170-175 [Google Scholar]
  23. M. Pashechko, K. Dziedzic, E. Mendyk, J. Jozwik Journal of Tribology 140 (2) (2017) DOI: 10.1115/1.4037953 [CrossRef] [Google Scholar]
  24. T. Światczak, M. Tomczyk, B. Więcek, R. Pawlak, R. Olbrycht Materials Science and Engineering B: Solid-State Materials for Advanced Technology 177 (15) 1239-1242 (2012) [CrossRef] [Google Scholar]
  25. T. Rymarczyk; P. Adamkiewicz, J. Sikora, Przeglad elektrotechniczny, 94 (1), 93-96 (2018). [Google Scholar]
  26. T. Rymarczyk; J. Szumowski, P. Adamkiewicz, P. Tchórzewski, J. Sikora, Przeglad elektrotechniczny, 94 (1) 97-100 (2018). [Google Scholar]

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.