MATEC Web Conf.
Volume 252, 2019III International Conference of Computational Methods in Engineering Science (CMES’18)
|Number of page(s)||4|
|Section||Probability, Statistics Quality Control|
|Published online||14 January 2019|
Computer measurement of the friction of thin metal structure created in PVD technology on the flexible substrate
Institute of Electrical Engineering Systems, Faculty of Electrical Engineering, Electronics, Informatics and Automatic Control, Lodz University of Technology, Stefanowskiego 18/22, 90-924 Łódź, Poland
2 Department of Production Engineering, Lublin University of Technology, Mechanical Engineering Faculty, Nadbystrzycka 36, 20-816 Lublin, Poland
3 The Institute of Technical Sciences and Aviation, The State School of Higher Education, Pocztowa Street 54, 22-100 Chelm, Poland
* Corresponding author: email@example.com
The paper presents the results of research study on the phenomenon of friction of thin film electroconductive structure created on composite flexible substrate and results of measurement of the friction coefficient. Tribological tests were performed on T-01M tribotester. The measurement tests were conducted according to ASTM G133 standard with a minimum force of 1N. A ball-on-disc friction combination was used. The study was conducted at a fixed temperature of 28 ° C. Due to the nature of the tested samples, non-standard test parameters were used: test time 100 s, data acquisition frequency 10 Hz, slip velocity of the friction node 0.3 m/s on a radius of 11 mm. Based on the obtained results, the friction coefficient of the thin metallic layer Ag and Cu was determined. The obtained mean friction coefficient for a silver layer was 0.59, while for a thin copper layer 0.67. The knowledge of the determined coefficients will allow for effective and optimal use of the textronics materials tested in practical applications. The research methodology does not support determining the usage of the ball-on-disc pair.
© The Authors, published by EDP Sciences, 2019
This is an open access article distributed under the terms of the Creative Commons Attribution License 4.0 (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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