Open Access
Issue |
MATEC Web Conf.
Volume 97, 2017
Engineering Technology International Conference 2016 (ETIC 2016)
|
|
---|---|---|
Article Number | 01059 | |
Number of page(s) | 6 | |
DOI | https://doi.org/10.1051/matecconf/20179701059 | |
Published online | 01 February 2017 |
- C.Y. Khor, M.Z. Abdullah, H.J. Tony Tan, W.C. Leong, D. Ramdan, Microelectron. Reliab., 52, 241 (2012) [CrossRef] [Google Scholar]
- C.Y. Khor, M.Z. Abdullah, F. Che Ani, Microelectron. Eng., 88, 3182 (2011) [CrossRef] [Google Scholar]
- C.Y. Khor, M.Z. Abdullah, W.C. Leong. IEEE Trans. Compon. Packag. Manuf. Technol., 2, 604 (2012) [CrossRef] [Google Scholar]
- M.S. Abdul Aziz, M.Z. Abdullah, C.Y. Khor, A.M. Iqbal, F. Che Ani, Int. J. Heat Mass Transfer, 72, 400 (2014) [CrossRef] [Google Scholar]
- C.S. Lau, M.Z. Abdullah, C.Y. Khor, Microelectron. Int., 30, 151 (2013) [CrossRef] [Google Scholar]
- L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S.A. Bidstrup Allen, S.T. Wang, J. Electron. Packaging, 122, 138 (2000) [CrossRef] [Google Scholar]
- J.H. Wu, A.A.O. Tay, IEEE Trans. Comp. Packag. Manuf. Technol. Part B: Adv. Packag., 21, 65 (1998) [CrossRef] [Google Scholar]
- C.C. Pei and S.J. Hwang, Transaction of the ASME Journal of Electronic Packaging, 127, 335 (2005) [CrossRef] [Google Scholar]
- D. Ramdan, M.Z. Abdullah, C.Y. Khor, W.C. Leong, W.K. Loh, C.K. Ooi, R.C. Ooi, IEEE Trans. Compon. Packag. Manuf. Technol., 2, 1786 (2012) [CrossRef] [Google Scholar]
- C.Y. Khor, M.Z. Abdullah, M.F.M.A. Majid, M.A. Mujeebu, M.K. Abdullah, Z.M. Ariff, Heat Mass Transfer., 46, 1315 (2010) [CrossRef] [Google Scholar]
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.