Open Access
MATEC Web Conf.
Volume 71, 2016
The International Conference on Computing and Precision Engineering (ICCPE 2015)
Article Number 04005
Number of page(s) 4
Section Advanced Manufacturing and Analysis Technology
Published online 02 August 2016
  1. Shanmugan, S.; Mutharasu, D. A.; Haslan, H. International Journal of Electronics and Computer Science Engineering. 2, 1 (2014).
  2. Kuo, P. K. G.; Auner, W.; Wu, Z. L. Thin Solid Films. 253 (1994).
  3. Lee, J. W.; Cuomo, J. J.; Cho, Y. S. ; Keusseyan, R. L. J. Amer. Ceram. Soci. 88, 7 (2005).
  4. Huaiyu, Y.; Koh, S. H.; Zeijl, V. A.; Gielen,; W. J..; Guoqi, Z. A review of pas-sive thermal management of LED module. J. Semicon. 32 (2011).
  5. Pan, T. S.; Zhang, Y.; Huang, J.; Zeng, B.; Hong, D. H.; Wang, S. L.; Zeng, H. Z.; Gao, M.; Huang, W.; Lin, Y. J. Appl. Phys. 112 (2012).
  6. Heo, Y. J.; Kim, H. T.; Kim, K. J.; Nahm, S.; Yoon, Y. J.; Kim, J.H. Applied Thermal Engineering. 50 (2013)
  7. Lu, X.Y. Hua, T. C.; Wang, Y.P. Microelectronics Journal, 42 (2011)
  8. Christensen, A.; Graham, S. Applied Thermal Engineering. 29 (2009).
  9. Yung, K.C.; Liem, H.; Choy, H.S.; Lun, W.K. International Communications in Heat and Mass Transfer, 37 (2010).
  10. Cheng, T.; Luo, X.B.; Huang, S.; Liu, S. International Journal of Thermal Sciences. 49(2010).
  11. Kim, Y.P.; Kim, Y.S.; Ko, S.C.; Microelectronics Reliability. 56 (2016).
  12. King, S. Y.; Tseng, J.; Zhao, .J. Applied Thermal Engineering. 52 (2013).
  13. Yang, K.S; Chung, C.H.; Tu, C.W.; Wong, C.C.; Yang, T.Y.; Lee. M.T.; Applied Thermal Engineering.70 (2014)
  14. Zheng, X.; Ren, Z.; Li, X.; Wang, Y. Applied Surface Science. 259 (2012)
  15. Figueroa, U.; Salas, O.; Oseguera, J. Surface and Coatings Technology, 200 (2005)
  16. Li, X.; Ren, Z.A.; Sun, D. Q. Materials Science and Engineering A,443 (2007)
  17. Rada, N. M.; Triplett, G. E. Solid-State Electronics. 54,4 (2010) [CrossRef]
  18. Rada, N. Triplett, G. Graham, S. Kovaleski. S. Solid-State Electronics. 52, 10 (2008) [CrossRef]
  19. Zheng, X.; Ren, Z.; Li, X.; Wang. Y. Applied Surface Science. 259,15(2012)
  20. Zuo, Z.J.; North, M.T.; Wert, K.L. IEEE Transactions on Components and Packaging Technologies.24,2 (2001) [CrossRef]
  21. Shinde, S. High Thermal Conductivity Materials, Springer, New York (2006) [CrossRef]
  22. Shen, W.Q.; Zhu Y.W.; Wang G.L. Appl. Sci. 5 (2015)

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.