MATEC Web Conf.
Volume 71, 2016The International Conference on Computing and Precision Engineering (ICCPE 2015)
|Number of page(s)||4|
|Section||Advanced Manufacturing and Analysis Technology|
|Published online||02 August 2016|
Using AlN-Coated Heat Sink to Improve the Heat Dissipation of LED Packages
1 School of Mechanical and Automotive Engineering/FuJian University of Technology, Fuzhou 350118, China
2 School of Nursing/National Taipei University of Nursing and Health Science, Taipei 11219, Taiwan
* Corresponding author: firstname.lastname@example.org
This study optimizes aluminum nitride (AlN) ceramics, in order to enhance the thermal performance of light-emitting diode (LED) packages. AlN coatings are grown on copper/ aluminum substrates as a heat interface material, using an electrostatic spraying process. The effect of the deposition parameters on the coatings is determined. The thermal performance of AlN coated Cu/Al substrates is evaluated in terms of the heat dissipated and compared by measuring the LED case temperature. The structure and properties of the coating are also examined a scanning electron microscopy (SEM). In sum, the thermal performance of the LED is increased and good heat resistance characteristics are obtained. The results show that using AlN ceramic coating on a copper/aluminum substrate increases the thermal performance.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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