MATEC Web of Conferences
Volume 7, 2013JA 2013 – Journées Annuelles de la SF2M 2013 / SF2M Annual Meeting 2013
|Number of page(s)||3|
|Section||Colloque 2 : Assemblages, Soudage et Collage / Joining, Welding and Sticking|
|Published online||07 November 2013|
- J. Yin et al., High temperature embedded SiC chip module (ECM) for power electronics applications, IEEE, Transactions on Power Electronics, 2007, 22: 392–398. [CrossRef] [Google Scholar]
- M.J. Jeng et al., Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts, Microelectronics Reliability, 2012, 52: 884–888. [CrossRef] [Google Scholar]
- S. Msolli et al., Viscoplastic behavior of diamond die attach subjected to high temperature conditions, IEEE, Proceeding EuroSimE, Portugal, 2012. [Google Scholar]
- C.C. Lee et al., A New Bonding Technology Dealing with Large CTE Mismatch Between Large Si Chips and Cu Substrates, IEEE, Electronic Components and Technology Conference, 2008, 1562–1568. [Google Scholar]
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.