Open Access
Issue
MATEC Web of Conferences
Volume 7, 2013
JA 2013 – Journées Annuelles de la SF2M 2013 / SF2M Annual Meeting 2013
Article Number 02013
Number of page(s) 3
Section Colloque 2 : Assemblages, Soudage et Collage / Joining, Welding and Sticking
DOI https://doi.org/10.1051/matecconf/20130702013
Published online 07 November 2013
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  2. M.J. Jeng et al., Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts, Microelectronics Reliability, 2012, 52: 884–888. [CrossRef]
  3. S. Msolli et al., Viscoplastic behavior of diamond die attach subjected to high temperature conditions, IEEE, Proceeding EuroSimE, Portugal, 2012.
  4. C.C. Lee et al., A New Bonding Technology Dealing with Large CTE Mismatch Between Large Si Chips and Cu Substrates, IEEE, Electronic Components and Technology Conference, 2008, 1562–1568.

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