MATEC Web Conf.
Volume 292, 201923rd International Conference on Circuits, Systems, Communications and Computers (CSCC 2019)
|Number of page(s)||5|
|Section||Circuits and Systems|
|Published online||24 September 2019|
Fluorescence investigation of epoxy resin LG 285 and mathematical description of the curing process
Tomas Bata University in Zlin, Faculty of Applied Informatics, Nad Stranemi 4511, 760 05 Zlin, Czech Republic
* Corresponding author: firstname.lastname@example.org
In this paper, steady-state fluorescence spectroscopy is used to investigate the curing of two-component epoxy resin LG 285. Moreover, the process of curing is mathematically described. The mixture of resin and hardener HG 287 is measured at five different temperatures (50 °C, 60 °C, 70 °C, 80 °C and 90 °C) for five and a half hours. The results indicate that the process of curing of epoxy resin decelerates with time and accelerates with increasing temperature. Furthermore, the energy of the barrier is calculated.
© The Authors, published by EDP Sciences, 2019
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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