MATEC Web Conf.
Volume 286, 201914th Congress of Mechanics (CMM2019)
|Number of page(s)||3|
|Section||Solid and Structural Mechanics Modelling|
|Published online||14 August 2019|
Probabilistic methodology for reliability assessment of electronic packages
LMN, Normandie Univ, INSA Rouen, 76000 Rouen, France & LIMII, FST Settat, BP: 577, Route de Casa, Settat
2 LIMII, FST Settat, BP: 577, Route de Casa, Settat, Morocco
3 LMN, Normandie Univ, INSA Rouen, 76000 Rouen, France
In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and randomness which will aﬀect the lifetime prediction quality. This paper focuses on solder joint reliability in tape-based chip-scale packages(CSP) with the consideration of uncertainties in material parameters.
Key words: Chip-Scale Packages / Finite-element analysis / Kriging metamodel / Monte-Carlo / Solder joint
© The Authors, published by EDP Sciences, 2019
This is an open access article distributed under the terms of the Creative Commons Attribution License 4.0 (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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