MATEC Web Conf.
Volume 232, 20182018 2nd International Conference on Electronic Information Technology and Computer Engineering (EITCE 2018)
|Number of page(s)||4|
|Section||Circuit Simulation, Electric Modules and Displacement Sensor|
|Published online||19 November 2018|
Solution for the Drift Problem of the Chip in the Packaging Process
State Key Lab of Advanced Power Transmission Technology, Global Energy Interconnection Research Institute, Beijing, 102209, China
a Corresponding author: firstname.lastname@example.org
This paper analyzes the drift phenomenon of the chips appearing in the packaging process of the fast recovery diode (FRD), and proposes an effective process to solve this problem. In order to improve the trade-off characteristics of fast recovery diodes, lifetime control methods, such as electron irradiation, high-energy ion implantation and so on, are often introduced in the chip manufacturing process. The chips described in this paper use the lifetime control method of electron irradiation. The problem of chips drift during the packaging process has been found. In this paper, by comparing different back metal schemes, comparing and analyzing the products of different manufacturers, the cause of chips drift is ultimately located in the annealing process after electron irradiation. The result of this paper shows that the chips drift phenomenon can be solved by adjusting the process steps.
© The Authors, published by EDP Sciences, 2018
This is an open access article distributed under the terms of the Creative Commons Attribution License 4.0 (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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