MATEC Web Conf.
Volume 228, 20182018 3rd International Conference on Circuits and Systems (CAS 2018)
|Number of page(s)||5|
|Section||Physics and Materials Engineering|
|Published online||14 November 2018|
The Microstructure Evolution of Thermal Deformation of Continuous Extrusion Copper Bus Bar
Xi’an Hitech Institute, Shaanxi, China
2 Fuzhou University, Fujian, China
The thermal deformation microstructure of continuous extrusion copper bus bar was observed and analyzed in the temperature range from 200°C to 700°C and at strain rate from 0.01s-1 to 10.0s-1 and at deformation amount from30% to 90% on Gleeble1500 test machine. The experiment results show that the higher the temperature, the lower the strain rate, the more dynamic recrystallization occurred. At the same strain rate, the copper bus bar changes from raw material of as-cast organization to recrystallization grain gradually as the deformation temperature and deformation degree increase, and the recrystallization grain size grows older with the rise of temperature. At the same deformation temperature, the temperature of recrystallization nucleation decreases while the strain rate increases. At low strain rate (0.01~1.0s-1), the dynamic recrystallization occurred at 500°C. While at high strain rate (10.0s-1), the recrystallization nucleation is advanced and it is already completed at 500°C. The Z parameters can be used to express the effect of deformation temperature and strain rate on the average grain size D, and the prediction model of the thermal deformation microstructure is obtained as follows: lnD=4.822-0.018lnZ
© The Authors, published by EDP Sciences, 2018
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