In-situ SEM and optical microscopy testing for investigation of fatigue crack growth mechanism under overload

Reliability and System Engineering Department, Beihang University, Beijing, China

^* Corresponding author: zhangwei.dse@buaa.edu.cn

Abstract

In this paper, the in-situ scanning electron microscope (SEM) and optical microscopy experiments are performed to investigate the crack growth behavior under the single tensile overload. The objectives are to (i) examine the overload-induced crack growth micromechanisms, including the initial crack growth acceleration and the subsequent retardation period; (ii) investigate the effective region of single overload on crack growth rate. The specimen is a small thin Al2024-T3 plate with an edge-crack, which is loaded and observed in the SEM chamber. The very high resolution images of the crack tip are taken under the simple variable amplitude loading. Imaging analysis is performed to quantify the crack tip deformation at any time instant. Moreover, an identical specimen subjected to the same load condition is observed under optical microscope. In this testing, fine speckling is performed to promote the accuracy of digital imaging correlation (DIC). The images around the crack tip are taken at the peak loads before, during and after the single overload. After that, the evolution of local strain distribution is obtained through DIC technique. The results show that the rapid connection between the main crack and microcracks accounts for the initial crack growth acceleration. The crack closure level can be responsible for the crack growth rate during the steady growth period. Besides that, the size of retardation area is larger than the classical solution.