MATEC Web Conf.
Volume 137, 2017Modern Technologies in Manufacturing (MTeM 2017 - AMaTUC)
|Number of page(s)||8|
|Section||Processes of Plastics and Composite Materials|
|Published online||22 November 2017|
Humidity influence on the adhesion of SU-8 polymer from MEMS applications
1 Technical University from Cluj-Napoca, Micro and Nano System Laboratory, 400641, B-dul Muncii 103-105, Romania
2 Laboratory of Modeling, Simulation and CAD, National Institute for R&D in Microtechnologies - IMT Bucharest, 126A Erou Iancu Nicolae Street, 077190, Bucharest, Romania
* Corresponding author: Corina.Barleanu@omt.utcluj.ro
In this paper, the adhesion behaviors of SU-8 polymer thin film from MEMS application were investigated as a function of relative humidity. The adhesion test between the AFM tip and SU-8 polymer have been extensively studied using the atomic force microscope (AFM), for a relative humidity (RH) varying between 20 and 90%. The samples for tests are SU-8 polymers hard baked at different temperatures. The hard bake temperature changes the tribo-mechanical properties of polymers. The paper reports the measurements and the modeling of adhesion forces versus humidity in controlled ranges between 20 to 90%RH. To investigate the effect of relative humidity on adhesion for SU-8 polymer hard baked we used an analytical method which encompasses the effect of capillarity as well as the solid-to-solid interaction. While the capillary force expression is considered to be the sum of the superficial tension and the Laplace force for the solid-solid interaction is expressed by the Derjagin, Muller and Toropov (DMT) model of solids adhesion. The analytical results obtained are in accordance with those obtained experimentally.
© The authors, published by EDP Sciences, 2017
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).
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