MATEC Web Conf.
Volume 67, 2016International Symposium on Materials Application and Engineering (SMAE 2016)
|Number of page(s)||6|
|Section||Chapter 3 Information Technology|
|Published online||29 July 2016|
Research on the Shape Precison of the Micro-groove in the Silicon under Diamond Fly-cutting
School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo, Henan Province, China
Based on the mechanical physical characteristics of the silicon wafers and the superior processing character of the diamond fly-cutting, the diamond fly-cutting was applied to the machining of the microgroove in the silicon, and the effect of the processing parameters on the machining shape precision of the microgroove arrays in the silicon was mainly studied. Firstly, the cutting model of the microgroove in cross section under the diamond fly-cutting was established and the theoretical curvature radius of the microgroove was obtained. Secondly, the shape precision of the microgroove is deduced. Finally, the processing experiment of the microgroove in the silicon was carried out. The experimental results reveal that the higher spindle speed n and the smaller cutting feed f are beneficial to machine the better microgroove in the silicon, but it is important to choose the appropriate cutting depth to machine the better microgroove in the silicon.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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