MATEC Web Conf.
Volume 63, 20162016 International Conference on Mechatronics, Manufacturing and Materials Engineering (MMME 2016)
|Number of page(s)||5|
|Section||Mechatronic and Application Engineering|
|Published online||12 July 2016|
The Acoustic Characteristic Investigation of Micro Plasma Shock Wave Obtained by Femtosecond Laser Ablation of Silicon Wafer Surface
1 College of electronic and information, Hubei University of Science and Technology, Xianning, China,
2 College of Physical Education, Hubei University of Science and Technology, Xianning, China,
3 College of biomedical engineering, Hubei University of Science and Technology, Xianning, China,
a Corresponding author: firstname.lastname@example.org
We experimentally investigate the acoustic characteristic of micro plasma shock wave obtained by femtosecond laser ablation of silicon wafer surface using F-P optical fiber acoustic sensor with anti electromagnetic interference. The experimental results show that each of the femtosecond laser pulse can only produce a plasma shock wave. Under the different femtosecond laser energy, the acoustic attenuation signal of single shock wave has been analyzed by using wavelet transform, the results indicated that the energy change of femtosecond laser has no effect on the frequency of the acoustic signal of the micro plasma shock wave and have only influence on the amplitude, meanwhile, the main frequency of the acoustic attenuation signal are distributed within range of 0-100KHz, According to these frequency components, we can conclude that the decay process of micro plasma shock wave is the fast transduction of the ultrasonic signal into the acoustic signal. This study can provide the experimental basis for femtosecond laser ablation mechanism and femtosecond laser plasma control application research.
© Owned by the authors, published by EDP Sciences, 2016
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