MATEC Web of Conferences
Volume 8, 2013Progress in Ultrafast Laser Modifications of Materials
|Number of page(s)||2|
|Section||Process characterization and some aspects of femtosecond laser direct writing|
|Published online||18 November 2013|
Optical Interference and Self-Scattering Effect On Laser Ablation of Thin Silicon Films
1 Debye Institute for Nanomaterials Science, Utrecht University, P. O. Box 80000, 3508 TA Utrecht, The Netherlands.
2 Department of Chemical Engineering and Materials Science, University of California, Davis.
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We report measurement of the ablation depth and self-reflectivity from thin silicon films illuminated by a single tightly focused femtosecond laser pulse. We show the dependence of ablation depth on incident laser pulse fluence can be modeled with a transfer-matrix method, taking into account transient reflectivity and light propagation in a stratified medium. We find optical interference effects in laser ablation of thin films are of crucial importance. Furthermore, We present the evidence of self-scattering effects due to the buildup of a three dimensional submicron sized plasma in the focal region.
© Owned by the authors, published by EDP Sciences, 2013
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