MATEC Web of Conferences
Volume 32, 2015International Symposium of Optomechatronics Technology (ISOT 2015)
|Number of page(s)||3|
|Section||Progress in microscopy and imaging|
|Published online||02 December 2015|
Evaluation of micro structure by fusion of three dimensional shape measurement and ultimate analysis using SEM
Kansai University, Department of Mechanical Engineering, 3-3-35 Yamate-cho, Suita, Osaka, Japan
a Yasuhiko Arai: email@example.com
The 3-D measurement method by SEM has already been proposed by using the principle of projection moiré. In this method, by the mechanism of producing some shadows of grid on the surface of the object by back scattering electron beam, a micro-size object can be measured in high resolution. However, in the case of measurement of industrial elements, not only 3-D shape measurement, but also the physical properties of material is sometimes required to check strongly for practical uses. For example, the precise patterning lines and the existence of some kinds of atoms in IC circuits are parameters concerning important feature of the circuits. The distribution of atoms in fractured sections is also an important feature in destructive inspection. In this paper, the realization of such inspection technology by combining the ultimate analysis and 3-D measurement method by SEM is discussed. The new measurement technology by fusion of 3-D shape measurement and ultimate analysis is proposed. In experimental results, the 3-D shape measurement of the micro object made of alloy material is measured. From measured results, the validity of the new method is discussed.
© Owned by the authors, published by EDP Sciences, 2015
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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