Issue |
MATEC Web of Conferences
Volume 27, 2015
2015 4th International Conference on Engineering and Innovative Materials (ICEIM 2015)
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|
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Article Number | 03005 | |
Number of page(s) | 5 | |
Section | Material processing and preparation technology | |
DOI | https://doi.org/10.1051/matecconf/20152703005 | |
Published online | 20 October 2015 |
Electrochemical Investigation on the Formation of Cu Nanowires by Electroless Deposition
Sustainable Electronic Materials Group, Department of Mining, Metallurgical and Materials Engineering, University of the Philippines, 1101 Diliman, Quezon City, Philippines
a Corresponding author: jefelizco@upd.edu.ph
b mdlbalela@gmail.com
The growth of copper (Cu) nanowires by electroless deposition in aqueous solution at 60-80 °C was studied from an electrochemical perspective using in situ mixed potential measurements and potential-pH diagrams. Scanning Electron Microscopy (SEM) showed that thick and short nanowires were obtained at high temperatures, while long and thin nanowires result from low reaction temperatures. In situ mixed potential measurements reveal that Cu(II) reduction is more favored at higher reaction temperatures, hastening the reduction reaction. The fast reaction leads to a high concentration of Cu atoms in the solution. As a result, Cu deposition occurs rapidly, such that they attached on both sides and ends of the primary Cu nanowires. This results to the formation of thick and short structures. On the other hand, thin and long nanowires are obtained due to the slow reduction reaction, which gives the Cu atoms more time to orderly attach in a wire-like formation.
© Owned by the authors, published by EDP Sciences, 2015
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