MATEC Web of Conferences
Volume 21, 20154th International Conference on New Forming Technology (ICNFT 2015)
|Number of page(s)||5|
|Section||Forging and Extrusion|
|Published online||10 August 2015|
Prediction of grain deformation in drawn copper wire
1 Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Sanmin District, Kaohsiung 80778, Taiwan
2 Metal Forming Technology Section, Metal Processing R&D Department, Metal Industries Research & Development Centre, 1001 Kaonan Highway, Kaohsiung 81160, Taiwan
a Corresponding author: email@example.com
Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copper wire based on finite element simulation with flow net analysis. Simple upsetting tests were conducted to obtain flow stress curves for the simulation of the drawing process. Predictions related to grain deformation were compared with those on the micrographs of the drawn copper wire obtained in experiments. In longitudinal and transverse cross-sections of the drawn wire, the predicted and experiment results presented similar trends involving considerable deformation within the grains. This preliminary study demonstrates the efficacy of the proposed method in providing information useful to the prediction of the grain deformation in drawn copper wire.
© Owned by the authors, published by EDP Sciences, 2015
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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