Issue |
MATEC Web of Conferences
Volume 12, 2014
FDMD II - JIP 2014 - Fatigue Design & Material Defects
|
|
---|---|---|
Article Number | 06005 | |
Number of page(s) | 3 | |
Section | Session 6.2: Surface Defects | |
DOI | https://doi.org/10.1051/matecconf/20141206005 | |
Published online | 09 June 2014 |
Fatigue crack growth from handling surface anomalies in a Nickel based superalloy at high temperature
1 Institut Pprime UPR CNRS 3346, Département Physique et Mécanique des Matériaux, ISAE-ENSMA, 86961 Futuroscope Chasseneuil, France
2 Snecma, Etablissement de Villaroche, 77550 Moissy Cramayel, France
a Corresponding author: stephane.gourdin@ensma.fr
Aircraft engine manufacturers have to demonstrate that handling surface anomalies in sensible areas of discs are not critical for in-service life of a component. Currently, the models used consider anomalies as long cracks propagating from the first cycle, which introduce a certain degree of conservatism when calculating the fatigue life of surface flaws. Preliminary studies have shown that the first stages of crack propagation from surface anomalies are responsible for the conservative results. Thus, the aim of the study is to characterize the crack propagation from typical surface anomalies and to establish a new crack growth model, which can account for the micro-propagation stage.
© Owned by the authors, published by EDP Sciences, 2014
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.