MATEC Web of Conferences

Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder

Guoqian Mu, Wenqing Qu, Xixiao Lv and Hongshou Zhuang

MATEC Web Conf., 269 (2019) 02005

Published online: 22 February 2019

DOI: 10.1051/matecconf/201926902005

Guoqian Mu

Wenqing Qu

Xixiao Lv

Hongshou Zhuang

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