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Solution for the Drift Problem of the Chip in the Packaging Process

Shaohua Dong, Yueyang Liu, Rui Jin, Guoqing Leng, Feng He, Jiang Liu, Yan Pan and Junmin Wu

MATEC Web Conf., 232 (2018) 04044

Published online: 19 November 2018

DOI: 10.1051/matecconf/201823204044

Shaohua Dong

Yueyang Liu

Rui Jin

Guoqing Leng

Feng He

Jiang Liu

Yan Pan

Junmin Wu

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)

eISSN: 2261-236X