MATEC Web of Conferences

Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni₃Al based Superalloy IC10

Xiong Yue, Fengmei Liu, Hexing Chen, Di Wan and Hongbo Qin

MATEC Web Conf., 206 (2018) 03004

Published online: 19 September 2018

DOI: 10.1051/matecconf/201820603004

Xiong Yue

Fengmei Liu

Hexing Chen

Di Wan

Hongbo Qin

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