MATEC Web Conf.
Volume 206, 20182018 The 3rd International Conference on Civil Engineering and Materials Science (ICCEMS 2018)
|Number of page(s)||5|
|Section||Material Science and Engineering|
|Published online||19 September 2018|
Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10
Guangdong Provincial Key Laboratory of Advanced Welding Technology, Guangdong Welding Institute (China-Ukraine E. O. Paton Institute of Welding), 510650 Guangzhou, China
2 School of Materials Science and Engineering, Central South University, 410083 Changsha, China
Transient liquid phase (TLP) bonding of Ni3Al-based superalloy IC10 was carried out using the interlayer based on the base metal which added B and Hf as the melting point depressant elements. The effect of bonding temperature (1250 – 1270 °C) on the microstructure evolution of bonding joints were investigated. Microstructure of bonding joint composed of isothermally solidification zone (ISZ) formed γ’ phase and athermally solidified zone (ASZ) which consists of newly formed γ+γ’ reticular eutectic among with borides and carbides. Boride precipitates are not formed in diffusion affected zone (DAZ) and the boundary between ASZ and ISZ become not obvious. Isothermally solidification rate decreases as the increase of the bonding temperature.
© The Authors, published by EDP Sciences, 2018
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