MATEC Web of Conferences

Material Selection for Interfacial Bond Layer in Electronic Packaging

D. Sujan, L. Vincent and Y. W. Pok

MATEC Web Conf., 202 (2018) 01005

Published online: 26 September 2018

DOI: 10.1051/matecconf/201820201005

D. Sujan

L. Vincent

Y. W. Pok

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)