MATEC Web of Conferences

Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

Y.W. Pok, D. Sujan, M.E. Rahman and S.S. Dol

MATEC Web Conf., 95 (2017) 01003

Published online: 09 February 2017

DOI: 10.1051/matecconf/20179501003

Y.W. Pok

D. Sujan

M.E. Rahman

S.S. Dol

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)